Substrate:HWB850
Haƙuri na Girma: - 0.1 mm
Hakuri mai kauri: ± 0.05mm
Lalacewar Sama:3 (1) @ 632.8nm
Ingancin saman: 60/40
Gefuna:Ƙasa, 0.3mm max. Cikakken nisa bevel
Share Budewa: ≥90%
Daidaituwa:<30"
Rufe: Rufin Bandpass @ 1550nm
CWL: 1550± 5nm
FWHM: 15 nm
T>90%@1550nm
Toshe Tsawon Tsayin: T<0.01%@200-1850nm
AOI: 0°